Planar view TEM sample preparation from circuit layer structures

Abstract

A method of preparing a planar view TEM sample of a planar portion of a circuit layer structure, the method comprising polishing the circuit layer structure until a cross-sectional polishing face of the circuit structure has substantially reached a first side face of the planar portion; forming a trench structure in the cross-sectional polishing face such that top and bottom faces of the planar portion are exposed; and performing a cut along the top and bottom faces of the planar region to free the planar view TEM sample.

Dependencies are inferred from the claim text.