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US 2006/0139045 A1Published application
Device and method for testing unpackaged semiconductor die
OwnerWesley Gallagher, Dennis Sheredy +1inventors
InventorsWesley Gallagher, Dennis Sheredy, Roy Darling
Life of this patent
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Abstract
An apparatus and method for testing singulated unpackaged semiconductor die.
Claims18
A singulated semiconductor die testing apparatus comprising:
- a first and second contact interface card;
- at least one of said interface cards adapted to be moveable with respect to the other between a relatively closed position and a relatively open position;
- said first test contact interface card having at least a first and second electrically conductive trace adapted to establish electrical contact with test equipment;
- a first set of test contact tooling attached to said first contact interface card between said first and second contact interface cards;
- said first set of test contact tooling having at least one compliant electrical contact;
- said compliant contact of said first set of test contact tooling electrically connected to said first conductive trace on said first contact interface card;
- said compliant contact of said first set of test contact tooling adapted to contact a first surface of a singulated bare die and establish electrical contact between said first surface of said die and said first conductive trace when said first and second test contact interface cards are in a relatively closed position;
- said second contact interface card having at least one conductive trace electrically connected to at least one spring biased electrical contact probe;
- said spring biased electrical contact probe, said first contact interface card, said second contact interface card and said second electrically conductive trace on said first contact interface card adapted and aligned to establish electrical contact between said spring biased electrical contact probe and said second conductive trace on said first contact interface card when said first and second contact interface cards are in a relatively closed position;
- a second set of test contact tooling attached to said second contact interface card between said first and second contact interface cards;
- said second set of test contact tooling having at least one compliant electrical contact;
- said compliant electrical contact of said second set of test contact tooling electrically connected to said conductive trace on said second contact interface card
- said compliant electrical contact of said second set of test contact tooling adapted to contact a second surface of a singulated bare die and establish electrical contact between said second surface of said die and said conductive trace on said second contact interface card when said first and second contact interface cards are in a relatively closed position.
10 more elements
A singulated semiconductor die testing apparatus comprising:
- a first and second contact interface card;
- at least one of said interface cards adapted to be moveable with respect to the other between a relatively closed position and a relatively open position;
- said first test contact interface card having at least a first and second electrically conductive trace adapted to establish electrical contact with test equipment;
- a first set of test contact tooling attached to said first contact interface card between said first and second contact interface card;
- said first set of test contact tooling having at least one compliant electrical contact;
- said compliant contact of said first set of test contact tooling electrically connected to said first conductive trace on said first contact interface card;
- said compliant contact of said first set of test contact tooling adapted to contact a first surface of a singulated bare die and establish electrical contact between said first surface of said die and said first conductive trace when said first and second test contact interface cards are in a relatively closed position;
- a spring biased electrical contact probe electrically connected to said second electrically conductive trace on said first contact interface card;
- said second contact interface card having at least one conductive trace;
- said spring biased electrical contact probe, said first contact interface card, said second contact interface card and said electrically conductive trace on said second contact interface card adapted and aligned to establish electrical contact between said spring biased electrical contact probe and said electrically conductive trace on said second contact interface card when said first and second contact interface cards are in a relatively closed position;
- a second set of test contact tooling attached to said second contact interface card between said first and second contact interface cards;
- said second set of test contact tooling having at least one compliant electrical contact;
- said compliant electrical contact of said second set of test contact tooling electrically connected to said conductive trace on said second contact interface card
- said compliant electrical contact of said second set of test contact tooling adapted to contact a second surface of a singulated bare die and establish electrical contact between said second surface of said die and said conductive trace on said second contact interface card when said first and second contact interface cards are in a relatively closed position.
11 more elements
Dependencies are inferred from the claim text.