Piezoelectric bimorph actuator and method of manufacturing thereof
OwnerAndy Askew, Gregory Lyoninventors
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Abstract
An actuator is disclosed, which includes a piezoelectric bimorph. The actuator also includes a substantially moisture impervious and electrically insulating packaging having a cavity around the bimorph providing for a clearance around the bimorph. The packaging includes a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further includes first and second cover films selectively attached to the first and second surfaces respectively, and at least one flex circuit connected to the bimorph for supplying electrical energy thereto.
Claims25
An actuator comprising:
- a piezoelectric bimorph;
- a substantially moisture impervious and electrically insulating packaging comprising a cavity around the bimorph providing for a clearance around the bimorph, the packaging comprising a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further comprising first and second cover films selectively attached to the first and second surfaces respectively;
- and
- at least one flex circuit connected to the bimorph for supplying electrical energy thereto.
A transducer comprising:
- a housing;
- and
- an actuator disposed within the housing, the actuator comprising:
- a piezoelectric bimorph;
- a substantially moisture impervious and electrically insulating packaging comprising a cavity around the bimorph providing for a clearance around the bimorph, the packaging comprising a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further comprising first and second cover films selectively attached to the first and second surfaces respectively;
- and
- at least one flex circuit connected to the bimorph for supplying electrical energy thereto.
A method for manufacturing an actuator:
- assembling a substantially moisture impervious and electrically insulating packaging comprising a carrier having first and second surfaces and an aperture,
- selectively attaching a first cover film to the first surface;
- inserting a piezoelectric bimorph within the packaging;
- connecting at least one flex circuit to the bimorph for supplying electrical energy thereto;
- and
- selectively attaching a second cover film to the second surface to form a cavity around the bimorph providing for a clearance around the bimorph.
Dependencies are inferred from the claim text.