Lead wire sealing device, recording disk drive, and method for sealing housing member

A recording disk drive comprising:

• a housing which forms a closed space therein and has a metal housing member at a lower side of the housing, the metal housing member having an upper surface facing the closed space of the housing and an lower surface facing an open space which is formed outside of the housing;
• an electric motor including a stator and a rotor, wherein the stator is fixed to the upper surface of the housing member and the rotor has a rotor magnet which is opposed to the stator in radial direction;
• a lead wire connecting from the stator to an electrode electrically isolated from and formed on the lower surface of the metal housing member for making an electrical connection with an outer device located in the open space;
• a housing through hole that is formed in the metal housing member and penetrates from the closed space to the open space, the lead wire being inserted in the housing through hole;
• a circuit board that is mounted on the lower surface of the metal housing member and having a board aperture overlapped to the housing through hole, wherein the lead wire is inserted into the board aperture and is connected to the electrode;
• a resin coating layer formed so as to coat the lower surface of the metal housing member;
• a metal surface exposed part of the metal housing member which is formed on a part of the resin coating layer, wherein the circuit board is securely held on the metal surface exposed part via an adhesive layer;
• and
• a sealing material which fills the board aperture of the circuit board at the open space.

A method of sealing a metal housing member that is a part of a housing which forms a closed space therein and includes an electric component housed therein, a lead wire connecting from the electric component to an electrode formed on an lower surface of the metal housing member in an open space, and a circuit board that is mounted on the lower surface of the metal housing member;

• the method comprising the steps of:
• preparing the metal housing member provided with a housing through hole formed on the metal housing member and penetrating from the closed space to the open space, a resin coating layer formed to cover the lower surface of the metal housing member, and a metal surface exposed part formed on a part of the resin coating layer;
• mounting the circuit board having a board aperture on the metal surface exposed part via an adhesive layer while overlapping the board aperture on the housing through hole;
• inserting the lead wire of the electric component into the housing through hole and the board aperture that are overlapped each other;
• and
• providing the sealing material on the circuit board to cover the board aperture.

A lead wire sealing device comprising:

• a metal housing member that is a part of a housing which forms a closed space therein, the metal housing member having an upper surface facing the closed space of the housing and an lower surface facing an open space which is formed outside of the housing;
• an electric component that is mounted on the upper surface of the metal housing member;
• a lead wire connecting from the electric component to an electrode electrically isolated from and formed on the lower surface of the metal housing member for making an electrical connection with an outer device located in the open space;
• a housing through hole that is formed in the metal housing member and penetrates from the closed space to the open space, the lead wire being inserted in the housing through hole;
• and
• a circuit board that is mounted on the lower surface of the metal housing member and having a board aperture overlapped to the housing through hole, wherein the lead wire is inserted into the board aperture and is connected to the electrode an adhesive layer mounted on the lower surface of the metal housing member for connecting the metal housing member to the circuit board;
• and
• a solder for covering the board aperture from the open space and connecting the lead wire to the circuit board.