US 2006/0138675 A1 · Solder structures for out of plane connections

Abstract

Methods of forming a solder structure may include providing a wafer including a plurality of die therein, and a solder wettable pad may be formed on one of the die adjacent an edge of the die. The solder wettable pad may have a length parallel to the edge of the die and a width perpendicular to the edge of the die wherein the length parallel to the edge of the die is greater than the width perpendicular to the edge of the die. A solder bump may be plated on the solder wettable pad, and the die may be separated from the wafer along the edge of the die after plating the solder bump on the solder wettable pad. Moreover, the solder bump may be reflowed on the solder wettable pad so that the solder structure extends laterally from the solder wettable pad beyond the edge of the die after separating the die from the wafer. Related structures are also discussed.

Claims29

Dependent claims

A solder structure comprising:

a substrate;
a solder wettable pad on the substrate adjacent an edge of the substrate, the solder wettable pad having a length parallel to the edge of the substrate and a width perpendicular to the edge of the substrate wherein the length parallel to the edge of the substrate is greater than the width perpendicular to the edge of the substrate;
and
a solder bump on the solder wettable pad wherein the solder bump extends laterally from the solder wettable pad at least to within about 10 microns the edge of the substrate.

1 more element

Dependencies are inferred from the claim text.

Solder structures for out of plane connections

Life of this patent

Solder structures for out of plane connections

Life of this patent

Abstract

Claims29