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US 2006/0138672 A1Published application
Electronic device and method of fabricating the same
AssigneeFujitsu Media Devices Limited
InventorsKaoru Sakinada, Takumi Kooriike, Shunichi Aikawa, Osamu Kawachi, Yasufumi Kaneda
Life of this patent
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Abstract
An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
Claims23
An electronic device comprising:
- a package substrate made of an insulator;
- a device chip that is flip-chip mounted on the package substrate;
- and
- a seal portion sealing the device chip,
- the seal portion being sidewalls made of solder.
2 more elements
A method of fabricating an electronic device comprising the steps of:
- flip-chip mounting a device chip on a package substrate;
- and
- supplying solder to at least one of the package substrate and the device chip and heating the solder to be melted so that a seal portion made of solder is formed on the package substrate.
A method of fabricating an electronic device comprising the steps of:
- flip-chip mounting device chips on a package substrate;
- and
- supplying solder to at least one of the package substrate and the device chips and heating the solder to be melted so that a seal portion made of solder is formed on the package substrate so as to cover the device chips.
Dependencies are inferred from the claim text.