Semiconductor device and fabrication method thereof
OwnerYoshimasa Kushimainventor
Life of this patent
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Abstract
A semiconductor device has rewiring that is electrically connected to circuit elements on a semiconductor substrate, and a plurality of posts electrically connected to the rewiring. The semiconductor device also has a sealing layer that seals the rewiring and the posts. A column-like identification protrusion whose cross-sectional shape is the shape of an identification mark for identifying the direction of the semiconductor device is provided. The identification protrusion is formed on the rewiring at the same time the posts are created. The end face of the identification protrusion is exposed at the upper face of the sealing layer and used as the identification mark of the semiconductor device.
Claims20
A semiconductor device comprising:
- a semiconductor substrate having a circuit formation face;
- at least one circuit element formed on the circuit formation face of the semiconductor substrate;
- rewiring electrically connected to the at least one circuit element;
- a plurality of posts electrically connected to the rewiring;
- a column-like identification protrusion formed on the rewiring and arranged in the vicinity of one of the plurality of posts;
- a sealing layer for sealing the rewiring, the column-like identification protrusion, and the posts;
- and
- an identification mark for identifying a direction of the semiconductor device, the identification mark being made by exposing an upper end of the identification protrusion from the sealing layer.
A method of fabricating a semiconductor device comprising:
- providing at least one circuit element on one surface of a semiconductor substrate;
- providing first rewiring that is electrically connected to the at least one circuit element;
- providing second rewiring that is not electrically connected to the at least one circuit element;
- providing a plurality of posts that are electrically connected to the first rewiring;
- providing an identification protrusion that is connected to the second rewiring;
- and
- providing a sealing layer that seals the first rewiring, second rewiring, posts and identification protrusion such that an end of the identification protrusion is exposed at an upper surface of the sealing layer to form an identification mark for identifying a direction of the semiconductor device.
Dependencies are inferred from the claim text.