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US 2006/0138652 A1Published application
Solder for device package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae-hoon Jang, Won-kyoung Choi
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Abstract
A solder for device packaging including a plurality of cores, and a coating solder mixed with the cores. The cores are formed of a material having a higher thermal conductivity than the coating solder.
Claims6
A solder for device packaging, comprising:
- a plurality of cores;
- and
- a coating solder mixed with the cores,
- wherein the cores are formed of a material having a higher thermal conductivity than the coating solder.
1 more element
Dependencies are inferred from the claim text.