Integrated circuit packaging device and method for matching impedance

An integrated circuit device, comprising:

• an integrated circuit chip having a plurality of first clip input/output elements;
• a packaging component having a plurality of package input/output elements;
• a plurality of connection elements for connecting the chip input/output elements with the package input/output elements;
• and
• a protective layer covering the integrated circuit chip, the plurality of connection elements, and a portion of the packaging such that the plurality of package input/output elements are uncovered,
• wherein a first chip input/output element selected from the plurality of chip input/output elements is connected to a first package input/output element selected from the plurality of package input/output elements by a first group of connection elements selected from the plurality of connection elements,
• wherein the first group of connection elements comprises two or more of the plurality of connection elements, and
• wherein the first group of connection elements are configured to provide a set input/output impedance at the first package input/output element.

A method of matching the input/output impedance of an integrated circuit device, comprising:

• attaching an integrated circuit chip having a chip input/output element to a packaging component having a package input/output element;
• connecting the chip input/output element to the package input/output elements with two or more connection elements in parallel;
• and
• covering the integrated circuit chip, the two or more connection elements, and a portion of the packaging with a protective material such that the package input/output element is uncovered,
• wherein the two or more connection elements are configured to provide a set input/output impedance at the package input/output element.