High power light emitting diode device

A circuit element comprising:

• a heat-conducting body having top and bottom surfaces;
• a die having an electronic device thereon, said die including first and second contact points for powering said electronic device, said die being in thermal contact with said heat-conducting body, said die having a bottom surface that is smaller than said top surface of said heat-conducting body;
• a first trace comprising an electrically conducting material bonded to said top surface of said heat-conducting body and electrically insulated therefrom;
• a first electrically conducting path from said first contact point to said first trace;
• and
• an encapsulating cap covering said die and said first electrically conducting path, said first trace having a first portion that extends outside of said encapsulating cap and a second portion that is covered by said encapsulating cap,
• wherein said bottom surface of said heat-conducting body comprises a surface having a greater surface area than said top surface of said heat-conducting body.