Semiconductor device

A semiconductor device comprising:

• a first semiconductor chip formed with a front side electrode and a reverse side electrode;
• a second semiconductor chip formed with a front side electrode and a reverse side electrode;
• a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode of the first semiconductor chip to be connected thereto, and on which the second semiconductor chip is mounted so as the front side electrode of the second semiconductor chip to be connected thereto;
• a second bus bar that is press-connected to the front side electrode of the first semiconductor chip;
• and
• a third bus bar that is press-connected to the reverse side electrode of the second semiconductor chip.

A semiconductor device comprising:

• a first semiconductor chip formed with a front side electrode and a reverse side electrode;
• a second semiconductor chip formed with a front side electrode and a reverse side electrode;
• a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode of the first semiconductor chip to be connected thereto;
• a second bus bar, arranged horizontally with respect to the first bus bar, on which the second semiconductor chip is mounted so as the reverse side electrode of the second semiconductor chip to be connected thereto;
• a first conductive member that connects with the front side electrode of the first semiconductor chip and comprises an extending section extending beyond the first semiconductor chip;
• a second conductive member that connects with the front side electrode of the second semiconductor chip and comprises an extending section extending to above the first bus bar;
• a third bus bar, arranged at a front surface side of the first semiconductor chip, with a part press-connected to the extending section of the first conductive member;
• and
• a fourth bus bar, arranged at a front surface side of the second semiconductor chip, with a part connected with the extending section of the second conductive member and press-connected to the first bus bar.

A semiconductor device comprising:

• first, second, third and fourth semiconductor chips formed with electrodes on front and reverse sides;
• a first bus bar on which the first and second semiconductor chips are mounted so as the reverse side electrodes to be connected thereto;
• a second bus bar, arranged horizontally with respect to the first bus bar, on which the third and fourth semiconductor chips are mounted so as the reverse side electrodes to be connected thereto;
• a third bus bar that is press-connected to the front side electrodes of the first and second semiconductor chips;
• a fourth bus bar that is press-connected to the front side electrodes of the third and fourth semiconductor chips;
• a connecting section that electrically connects the first bus bar and the fourth bus bar;
• a first pressing member arranged on the third bus bar so as to press the third bus bar towards the first semiconductor chip;
• a second pressing member arranged on the third bus bar so as to press the third bus bar towards the second semiconductor chip;
• a third pressing member arranged on the fourth bus bar so as to press the fourth bus bar towards the third semiconductor chip;
• and
• a fourth pressing member arranged on the fourth bus bar so as to press the fourth bus bar towards the fourth semiconductor chip.