Stacked ball grid array packages

A flexible circuit board for mounting first and second ball grid array (BGA) packages on a motherboard, comprising:

• a first array of contact pads on a central portion of a first surface;
• a second array of contact pads on a central portion of a second surface opposed to the first surface;
• and
• an array of solder ball pins on each of two side portions of the first surface, the side portions extending from opposite sides of the central portion;
• wherein the side portions are foldable relative to the central portion so as to bring the solder ball pins on the side portions directly underneath the central portion of the second surface so as to be attachable to the motherboard.

An arrangement of ball grid array (BGA) packages, comprising:

• a flexible circuit board having first and second opposed surfaces defining a central portion and first and second side portions extending from opposite sides of the central portion;
• a first BGA package having a first array of solder ball pins on a first surface thereof that are conductively attached to the first surface of the flexible circuit board in the central portion thereof;
• a second BGA package having first and second opposed surfaces and a second array of solder ball pins on the first surface thereof that are conductively attached to the second surface of the flexible circuit board in the central portion thereof;
• and
• a third array of solder ball pins on each of the side portions of the flexible circuit board on the first surface thereof;
• wherein the second surface of the flexible circuit board is attached at the side portions thereof to the second surface of the second BGA package, so as to orient the third array of solder ball pins for attachment to a motherboard.