Stack chip package
AssigneeDomintech Co., Ltd.
InventorChung-Hsing Tzu
Life of this patent
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Abstract
An improved stack chip package comprising a lead frame, chip, plural leads and coating, among which: the lead frame is made of metal materials through impact extrusion forming two or four lines of rectangular plural pins comprising three lead segments making the pin -shaped; So install a chip on the first segment's inside surface, bond wires at the chip's bond pads and each segment will form an electrical connection, coat the part where the lead is jointed for the completion of sealing operation, i.e. the chip's upper and lower sides can be connected to another chip package by the contact of the first and second segments, and the chip package can be stacked freely besides reduced volume and strengthened data processing performance.
Claims5
An improved stack chip package consists of a lead frame, a chip, plural leads and coating, featuring:
- a lead frame consists of plural pins in rows. Each pin comprises three segments, i.e. first lead segment, second lead segment and connecting part connected to the first and second lead segment. Thereby, install a chip on the inside surface of the first segment of each pin of the lead frame and fix it, bond conductive wire at the bond pads of the chip and each segment of pins respectively to form an electrical connection, coat the part around the chip where the lead is jointed to complete the sealing operation and to have the first and second lead segment and the connecting part jutted on the both surfaces and sides of the chip, and then the obtained plural chip package can be stack through each pin of the lead frame.
Dependencies are inferred from the claim text.