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US 2006/0138622 A1Published application
One step capillary underfill integration for semiconductor packages
OwnerDaoqiang Lu, Tian-An Chen +1inventors
InventorsDaoqiang Lu, Tian-An Chen, Mike Garner
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Abstract
The present invention relates to a semiconductor package containing a package substrate, integrated heat spreader, and semiconductor die. An underfill material is embedded in the semiconductor package serving both as underfill and sealant.
Claims12
A semiconductor package comprising:
- a substrate;
- an integrated heat spreader;
- a semiconductor die attached to said integrated heat spreader forming a composite, wherein said semiconductor die is bonded to said substrate;
- and
- an underfill material between said semiconductor die and said substrate and between said integrated heat spreader and said substrate.
2 more elements
12-29. (canceled)
Dependencies are inferred from the claim text.