Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
OwnerTongbi Jiang, Jerrold Kinginventors
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Abstract
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Claims20
An electrical connector for an integrated circuit package comprising:
- a composite lead frame of a plastic material having a portion thereof including a conductive polymer, the lead frame transparent to radiation.
A circuit card comprising:
- at least one electronic device;
- a circuit card;
- and
- at least one connector for attaching a portion of the at least one electronic device to a portion of the circuit card, the at least one electronic device comprising an integrated circuit die attached to a portion of a plastic lead frame, the plastic lead frame including an intrinsic conductive polymer.
A computer system comprising at least one circuit card including an electronic device connected to a portion of a plastic connector including an intrinsic polymer material transparent to radiation.
An encapsulated assembly including portions of a lead frame extending therefrom and a semiconductor device comprising:
- a lead frame of a plastic material that is conductive;
- a semiconductor device having a plurality of bond pads;
- and
- at least one connection between a portion of the lead frame and at least one bond pad of the integrated circuit die.
Dependencies are inferred from the claim text.