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US 2006/0138613 A1Published application
Integrated circuit package with inner ground layer
OwnerHenry Tin-Hang Yunginventor
Life of this patent
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Abstract
An integrated circuit package includes a lead frame having a plurality of leads and a metal layer; an integrated circuit die having a plurality of power-level bond pads; a plurality of first bond wires electrically connected between the power-level bond pads and the metal layer, respectively; and a second bond wire electrically connected between the metal layer and a lead of the lead frame.
Claims13
An integrated circuit package, comprising:
- a lead frame having a plurality of leads and a metal layer;
- an integrated circuit die having a plurality of power-level bond pads;
- a plurality of bond wires electrically connected between the power-level bond pads and the metal layer, respectively;
- and
- wherein said metal layer is electrically connected to a lead of said lead fram.
2 more elements
A method of packaging an integrated circuit die, the integrated circuit die having a plurality of power-level bond pads, the method comprising:
- providing a lead frame with a plurality of leads and a metal layer;
- mounting the integrated circuit die on the lead frame;
- electrically connecting the power-level bond pads to the metal layer, respectively;
- and
- electrically connecting the metal layer to a lead of the lead frame.
2 more elements
Dependencies are inferred from the claim text.