IC substrate with over voltage protection function
AssigneeInpaq Technology Co., Ltd.
InventorChun-Yuan Lee
Life of this patent
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Abstract
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.
Claims5
An IC substrate with over voltage protection functions, comprising:
- a substrate;
- one or more variable resistance material layers disposed on a lower surface of the substrate;
- a grounding conductor layer for forming a grounding terminal, said grounding terminal being disposed on the lower surface of the substrate and extending to overlay each of the variable resistance material layers so as to form a connection with each of the variable resistance material layers;
- and
- a plurality of conductor layers for forming electrode terminals, each of the conductor layers being disposed on an upper surface of the substrate and connected with each of the variable resistance material layers.
Dependencies are inferred from the claim text.