Ball grid array IC substrate with over voltage protection function
AssigneeInpaq Technology Co., Ltd.
InventorChun-Yuan Lee
Life of this patent
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Abstract
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.
Claims4
A ball grid array (BGA) IC package with over voltage protection functions, comprising:
- a BGA IC package having a substrate;
- a plurality of grounding conductor layers for forming grounding terminals and disposed on a surface of the BGA IC package;
- one or more variable resistance material layers overlaying on the grounding conductor layers and connected with them;
- and
- a plurality of electrode materials, wherein the variable resistance material layers are connected with the plurality of the electrode terminals and the plurality of grounding conductor layers.
(canceled)
Dependencies are inferred from the claim text.