IC substrate with over voltage protection function
AssigneeInpaq Technology Co., Ltd.
InventorChun-Yuan Lee
Life of this patent
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Abstract
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.
Claims5
An IC substrate with over voltage protection functions, comprising:
- a first substrate;
- a plurality of the first grounding conductor layers disposed through the first substrate, thereby terminals of the first grounding conductor layers being exposed on an upper surface and a lower surface of the first substrate;
- a second substrate disposed on the first substrate;
- a plurality of the second conductor layers disposed through the second substrate, thereby terminals of the second conductor layers being exposed on an upper surface and a lower surface of the second substrate, wherein the terminals exposed on the lower surface of the second substrate are connected with the first conductor layers exposed on the upper surface of the first substrate;
- a grounding conductor layer for forming a grounding terminal disposed on the lower surface of the second substrate;
- one or more variable resistance material layers disposed through the second substrate, so that lower portion terminals of the variable resistance material layers is connected with the grounding conductor layer and upper terminals of the variable resistance material layers are exposed on the upper surface of the second substrate;
- a third substrate disposed on the upper surface of the second substrate;
- and
- a plurality of the third conductor layers for forming electrode terminals through the third substrate, the terminals exposed on a lower surface terminals of the third substrate being connected with the second conductor layers of the second substrate, and terminals of the third conductor layers being exposed on the upper surface of the third substrate.
Dependencies are inferred from the claim text.