Image sensor package, solid state imaging device, and fabrication methods thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsKyu-ho Shin, Chang-youl Moon, Arthur Darbinian
Life of this patent
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Abstract
An image sensor package and a solid state imaging device. The image sensor package includes an image sensor having an image sensor and connection pads on a wafer. A transparent plate is attached to the upper surface of the image sensor chip via an adhesive. The connection pads include connectors, and the image sensor package exchanges signals with a main board of the solid image device through the connectors.
Claims13
An image sensor package which is electrically connected to a main board of a solid image device for exchange of signals, comprising:
- an image sensor chip having an image sensor and a connection pad;
- a transparent plate attached to the image sensor chip;
- and
- a connector, one side of which is connected to the connection pad and the other side of which is connected to the main board.
A solid state imaging device, comprising:
- a main board;
- an image sensor chip having an image sensor and a connection pad;
- a transparent plate attached to the image sensor chip;
- a connector, one side of which is connected to the connection pad and the other side of which is connected to the main board;
- and
- a lens housing mounted on a side of the main board opposite the connector.
A method for fabricating an image sensor package, which comprises:
- a) providing a wafer having a plurality of image sensors and connection pads;
- b) coating a surface of the wafer where the image sensors are formed with an adhesive;
- c) attaching a transparent plate;
- d) patterning the transparent plate;
- and
- e) dicing the wafer.
A method for fabricating a solid state imaging device, which comprises:
- a) providing a wafer having a plurality of image sensors and connection pads;
- b) coating a surface of the wafer with an adhesive;
- c) attaching a transparent plate, d) patterning the transparent plate;
- e) forming connectors on the connection pads;
- f) dicing the wafer;
- g) mounting the connectors on one side of the main board;
- and
- h) mounting a lens housing having a lens on the other side of the main board.
Dependencies are inferred from the claim text.