CMOS image sensor and method for manufacturing the same
AssigneeDongbuAnam Semiconductor Inc.
InventorShang Kim
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Abstract
Disclosed are a CMOS image sensor capable of improving the focusing capability of light and a method for manufacturing the same. The CMOS image sensor includes a plurality of first micro-lenses formed in the upper part of the planarization layer, each of the first micro-lenses arranged over a corresponding photodiode, and a plurality of second micro-lenses formed on the planarization layer, each of the plurality of second micro-lenses wrapping a corresponding first micro-lens respectively.
Claims14
A CMOS image sensor comprising:
- a semiconductor substrate;
- a plurality of photodiodes arranged on the semiconductor substrate with a predetermined distance therebetween;
- an inter-insulation layer formed on the overall surface of the semiconductor substrate including the photodiodes;
- a plurality of color filter layers arranged on the inter-insulation layer with a predetermined distance therebetween;
- a planarization layer formed on the overall surface of the semiconductor substrate including the color filter layers;
- a plurality of first micro-lenses formed in upper part of the planarization layer, each of the first micro-lenses arranged over a corresponding photodiode, respectively;
- and
- a plurality of second micro-lenses formed on the planarization layer, each of the plurality of second micro-lenses wrapping a corresponding first micro-lens respectively.
A CMOS image sensor comprising:
- a plurality of first micro-lenses, each of the first micro-lenses arranged over a corresponding photodiode;
- and
- a plurality of second micro-lenses formed on the planarization layer, each of the plurality of second micro-lenses wrapping a corresponding first micro-lens respectively;
- wherein the index of refraction of the first micro-lenses is smaller than the index of refraction of the second micro-lenses.
A method for manufacturing a CMOS image sensor comprising the steps of:
- forming an inter-insulation layer over a semiconductor substrate;
- forming a plurality of color filter layers on the inter-insulation to be arranged with a predetermined distance therebetween;
- forming a planarization layer on the overall surface of the semiconductor substrate including the color filter layers;
- forming a plurality of trenches having a predetermined depth in upper part of the planarization layer to correspond to the photodiodes in a one-to-one ratio;
- forming first micro-lenses in the trenches, respectively;
- and
- forming second micro-lenses on the planarization layer to wrap the first micro-lenses, respectively.
Dependencies are inferred from the claim text.