US 2006/0138452 A1Published application

Power semiconductor module

AssigneeABB Research Ltd.

InventorsWolfgang Knapp, Stefanie Apeldoorn

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Abstract

A power semiconductor module (1) with a housing (2) and at least one semiconductor chip (3, 3′) located in it is devised. At least one semiconductor chip (3, 3′) has a first main electrode side (31) and a second main electrode side (32) opposite the first main electrode side, the first main electrode side (31) making thermal and electrical contact with the first base plate (4, 4′). The first cooling device (6) makes thermal and electrical contact with the side of the first base plate (41) facing away from the first main electrode side. The second main electrode side (32) makes thermal and electrical contact with a second base plate (5, 5′). A second cooling device (7) makes thermal contact with the side of the second base plate (51) facing away from the second main electrode side. The heat sink (65) of the first cooling device is supported against the housing (2).

Claims32

Dependent claims

Power semiconductor module, comprising

at least one semiconductor chip which has a first main electrode side and a second main electrode side opposite the first main electrode side, the first main electrode side making thermal and electrical contact with the first base plate, and the second main electrode side making thermal and electrical contact with a second base plate,
a first cooling device with a first main electrode connecting element and a heat sink, the first main electrode connecting element making thermal and electrical contact with the side of the first base plate facing away from the first main electrode side, and the heat sink making thermal contact with the side of the first main electrode connecting element facing away from the first main electrode side, and
a second cooling device which makes thermal contact with the side of the second base plate facing away from the second main electrode.side, wherein the power semiconductor module has a housing in which at least one semiconductor chip and the first and second cooling device are located and wherein the heat sink of the first cooling device is supported against the housing.

Dependencies are inferred from the claim text.

Facts

Application: 11/304,703Filed 16 Dec 2005
Priority: EP 04405776.816 Dec 2004
Published: 29 Jun 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10W 90/00
Package configurations
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 40/611
Securing means for detachable heating or cooling arrangements, e.g. clamps: bolts or screws
H10W 76/138
Containers comprising a conductive base serving as an interconnection: having another interconnection being formed by a cover plate parallel to…