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US 2006/0138444 A1Published application
Flip-chip bonding structure of light-emitting element using metal column
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWon-kyoung Chio, Tae-hoon Jang, Su-hee Chae, Hyung-kun Kim
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Abstract
A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting element with the sub-mount electrically and thermally.
Claims21
A flip-chip bonding structure of a light-emitting element, comprising:
- a light-emitting element:
- a sub-mount;
- and
- a metal column connecting the light-emitting element with the sub-mount electrically and thermally.
1 more element
A flip-chip bonding structure of a light-emitting element, comprising:
- a light-emitting element;
- a sub-mount;
- a metal column for connecting the light-emitting element with the sub-mount electrically and thermally;
- and
- metal pad layers interposed between the light-emitting element and the metal column, and between the sub-mount and the metal column, improving an adhesive efficiency with respect to the metal column,
- wherein the thermal conductivity of the metal column is greater than that of the sub-mount.
3 more elements
Dependencies are inferred from the claim text.