Light emitting diode package and process of making the same

A process of making a light emitting diode (LED) package, comprising:

• providing a silicon-on-insulator (SOI) substrate, which is composed of a first silicon based material, a second silicon based material, and an insulation layer which is interposed therebetween;
• etching the first silicon based material and the second based material of the silicon-on-insulator substrate respectively to form a reflective cavity and an insulation trench, wherein the insulation trench divides the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes;
• forming a plurality of metal lines on the silicon-on-insulator substrate;
• and
• mounting an LED chip on the reflective cavity of the silicon-on-insulator substrate, wherein the positive and negative electrodes of the LED chip electrically connect to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines respectively.