Removing solution
AssigneeDaikin Industries, Ltd.
InventorsMitsushi Itano, Takashi Kanemura, Shingo Nakamura, Fumihiro Kamiya, Takehiko Kezuka
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Abstract
The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.
Claims73
A resist-removing solution for low-k film comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents.
A cleaning solution for a via hole or a capacitor comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents.
Dependencies are inferred from the claim text.