Apparatus and method for inspecting semiconductor wafers for metal residue
OwnerJin Leeinventor
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Abstract
An apparatus and method for inspecting metal residue is disclosed, in which the metal residue and its residual thickness are effectively inspected after a chemical mechanical polishing (CMP) process. The apparatus for inspecting metal residues includes a light emitter emitting light having a certain wavelength to a surface of a semiconductor substrate, a light detector receiving light reflected from the surface, and an output device configured to produce a signal corresponding to one or more wavelengths of said reflected light. Thus, it is possible to determine the presence and/or thickness of metal residue using the wavelength or wavelengths of the reflected light.
Claims24
An apparatus for inspecting metal residue on a surface of a semiconductor substrate, said apparatus comprising:
- a light emitter configured to emit light having a certain wavelength to said surface;
- a light detector receiving reflected light from said surface;
- and
- an output device configured to produce a signal corresponding to one or more properties of said reflected light.
A method for inspecting metal residue on a surface of a semiconductor substrate, said method comprising the steps of:
- a) emitting light having a certain wavelength to said surface;
- b) detecting light reflected from said surface;
- c) outputting a signal corresponding to one or more properties of said reflected light;
- and
- d) correlating a presence and/or absence of residual metal on said surface to a value of said signal.
A process for fabricating a semiconductor wafer, said process comprising:
- a) applying a layer of metal to a surface of said semiconductor substrate;
- b) polishing a portion of said metal off of said surface;
- c) directing light from a light source at said wafer;
- d) measuring, with a light detector, reflected light from said surface;
- and
- e) determining a presence or absence of residual metal from said measured reflected light.
Dependencies are inferred from the claim text.