Method of manufacturing an electronic component and apparatus for carrying out the method
OwnerHaruo Watanabeinventor
Life of this patent
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Abstract
An electronic-component manufacturing apparatus includes a supply mechanism that supplies a lead-frame terminal component whose fuse portion is filled with a solder material in advance, a carrier unit that carries the terminal component, a flux application unit that applies flux to the fuse portion, a preheating zone that performs preheating, and a reflow unit that performs main-heating.
Claims12
A method of manufacturing an electronic component of a lead frame type including a circuit part, the method comprising:
- disposing a solder material on the circuit part of the electronic component;
- and
- melting the solder material by a heat source to fix it to the circuit part,
- wherein
- the heat source is a hot blast.
A method of manufacturing an electronic component, the method comprising:
- placing a lead-frame terminal component whose fuse portion is filled with a solder material in advance to a supply mechanism;
- carrying the terminal component;
- applying flux to the fuse portion;
- preheating the fuse portion;
- and
- main-heating the fuse portion.
An apparatus for manufacturing an electronic component of a lead frame type including a circuit part, the apparatus comprising:
- a solder fixing unit that disposes a solder material on the circuit part of the electronic component;
- and
- a heating unit that melts the solder material by a heat source to fix it to the circuit part, wherein
- the heat source is a hot-blast supply unit that emits hot air.
An apparatus for manufacturing an electronic component, the apparatus comprising:
- a supply mechanism that supplies a lead-frame terminal component whose fuse portion is filled with a solder material in advance;
- a carrier unit that carries the terminal component;
- a flux application unit that applies flux to the fuse portion;
- a preheating unit that preheats the fuse portion;
- and
- a reflow unit that main-heats the fuse portion.
Dependencies are inferred from the claim text.