Processing a memory link with a set of at least two laser pulses
OwnerYunlong Sun, Edward Swenson +1inventors
InventorsYunlong Sun, Edward Swenson, Richard Harris
Life of this patent
Estimating the term…
Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
Claims25
A laser system for severing a conductive link in an integrated circuit (IC), comprising:
- a laser source operable to generate at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- a beam positioning system operable to utilize position data representative of locations of one or more conductive links and to coordinate directing on-the-fly the laser pulses to a selected conductive link, wherein the first and second laser pulses are sequentially directed to the selected conductive link, at least one of the first and second laser pulses removes a depth of link material that is less than the link thickness, and the laser pulses sever the selected conductive link.
A laser system for severing a conductive link in an integrated circuit (IC), comprising:
- a beam positioning system operable to utilize position data representative of locations of one or more conductive links and to coordinate directing on-the-fly at least two laser pulses to a selected conductive link, the laser pulses including a first laser pulse and a second laser pulse,
- wherein the first laser pulse and the second laser pulse are sequentially directed to the selected conductive link, at least one of the first and second laser pulses removes a depth of link material that is less than the link thickness, and the laser pulses sever the selected conductive link.
A laser system for severing a conductive link in an integrated circuit (IC), comprising:
- a laser source operable to generate at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- a beam positioning system operable to utilize position data representative of locations of one or more conductive links and to coordinate directing on-the-fly the laser pulses to a selected conductive link, wherein the first and second laser pulses are sequentially directed to the selected conductive link, at least one of the first and second laser pulses is insufficient to sever the selected conductive link, and the laser pulses sever the selected conductive link.
A laser system for severing a conductive link in an integrated circuit (IC), comprising:
- a laser source operable to generate a beam comprising at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- a beam positioning system operable to utilize position data representative of locations of one or more conductive links and to coordinate directing on-the-fly the laser pulses to a selected conductive link, wherein the first and second laser pulses are sequentially directed to the selected conductive link, at least one of the first and second laser pulses is insufficient to sever the selected conductive link, and the laser pulses sever the selected conductive link.
Dependencies are inferred from the claim text.