Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

A multilayer printed wiring board manufacturing apparatus, to be used for processing a multilayer printed wiring board having an interlayer resin insulator, comprising a processing laser source, a scanning head for deflecting the laser beam in the X-Y directions, a camera for reading the positioning marks of a multilayer printed wiring board, an X-Y table for placing a multilayer printed wiring board, an input section for inputting the processing data of the multilayer printed wiring board, a memory section for storing the processing data or the arithmetic operations result and an arithmetic operating section, wherein

• said X-Y table is provided with a light source embedded at the area corresponding to the positioning mark of the multilayer printed wiring board;
• the processing data is input from the input section and the processing data is stored in the memory section;
• silhouette generated when the light beam from the light source of the X-Y table is shielded by the positioning mark is read by the camera to measure the position of the positioning mark of the multilayer printed wiring board placed on the X-Y table;
• the data for driving the scanning head and the X-Y table is generated from the measured position and the input processing data in the arithmetic operating section, and the drive data is stored in the memory section;
• and
• the drive data is read from the memory section and then the X-Y table and the scanning head are controlled in the control section and thereby the laser beam is radiated to the multilayer printed wiring board to eliminate the interlayer resin layer to form the hole.

A multilayer printed wiring board manufacturing method utilizing a manufacturing apparatus comprising a processing laser source, a scanning head for deflecting the direction of laser beam in the X-Y directions, a camera for reading the positioning mark of the multilayer printed wiring board and an X-Y table for placing the multilayer printed wiring board to be provided with a light source embedded to the area corresponding to the positioning mark of the multilayer printed wiring board, comprising the steps of:

• forming the positioning mark and an interlayer insulating agent layer on the multilayer printed wiring board;
• inputting the processing data to said manufacturing apparatus;
• reading, with a camera, a silhouette which is generated when the light beam from the light source of said X-Y table is shielded by said positioning mark of the multilayer printed wiring board placed on the X-Y table to measure the position of positioning mark of the multilayer printed wiring board;
• generating the data for driving the scanning head and the X-Y table from the measured position and said input processing data;
• and
• controlling the X-Y table and the scanning head on the basis of said drive data and radiating the laser beam to the multilayer printed wiring board to eliminate the interlayer resin layer to form a hole.