Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

A multilayer printed wiring board manufacturing apparatus, to be used for processing a multilayer printed wiring board having an interlayer resin insulator, comprising:

• a processing laser source, a scanning head for deflecting the laser beam in the X-Y directions, a camera for reading the target marks of a multilayer printed wiring board, an X-Y table for placing a multilayer printed wiring board, an input section for inputting the processing data of the multilayer printed wiring board, a memory section for storing the processing data or the arithmetic operations result and an arithmetic operating section, wherein
• the processing data is input from the input section and this processing data is stored in the memory section;
• position of the target mark of the multilayer printed wiring board placed on the X-Y table is measured with the camera;
• data to drive the scanning head and the X-Y table is generated from the measured position and the input processing data in the arithmetic section and this drive data is then stored in the memory section;
• and
• the drive data is read from the memory section and then the X-Y table and the scanning head are controlled in the control section and thereby the laser beam is radiated to the multilayer printed wiring board to eliminate the interlayer resin layer to form the hole,
• said manufacturing apparatus being provided with at least two or more scanning heads, a beam splitter provided between said processing laser source and an optical path of the scanning head, the beam splitter distributing and supplying the laser beam to each scanning head.

A multilayer printed wiring board manufacturing method comprising the steps of:

• forming a target mark on a multilayer printed wiring board having an interlayer resin insulator;
• placing the multilayer printed wiring board having formed said target mark on the X-Y table of the multilayer printed wiring board manufacturing apparatus comprising a processing laser source, at least two or more scanning heads for deflecting the direction of laser beam to the X-Y directions, a camera for reading the target mark of the multilayer printed wiring board, an X-Y table for placing the multilayer printed wiring board, an input section for inputting the processing data of the multilayer printed wiring board, a memory section for storing the processing data or the arithmetic operations result and an arithmetic operating section, and then inputting the processing data to the manufacturing apparatus;
• measuring, with the camera, the position of the target mark of the multilayer printed wiring board, generating the data for driving the scanning heads and the X-Y table from the measured position and the input processing data in the arithmetic operating section and storing the drive data to the memory section;
• and
• reading the drive data from the memory section and controlling the X-Y table and the scanning heads in the control section and radiating the laser beam to the multilayer printed wiring board to eliminate the interlayer resin layer to form the hole for the via hole, wherein
• the laser beam is distributed by a beam sputter arranged between said processing laser source and an optical path of the scanning head and is then supplied to said two or more scanning heads.