Wafer electroplating apparatus

A wafer electroplating apparatus for flow rectification and removing bubbles in an electroplating solution during a wafer electroplating process, comprising:

• an electroplating bath main body, comprising:
• an inlet device;
• a first de-bubble tank disposed in a lower part of said electroplating bath main body and connected to said inlet device;
• an air hole disposed on an upper surface of said first de-bubble tank and extending to an outer surface of said electroplating bath main body;
• and
• a baffle below said inlet device for an electroplating solution being prevented from entering said inlet device directly but passing along sides of said baffle instead, and therefore being buffered before entering said inlet device;
• and
• a fixing device comprising a second de-bubble tank and an outer shell, wherein when said electroplating bath main body is combined with said fixing device, said baffle is separated from an inner surface of said second de-bubble tank by a predetermined distance, and said outer shell is coupled to an inner surface of said first de-bubble tank, and said second de-bubble tank couples with said first de-bubble tank to form a de-bubble area for guiding said electroplating solution flow toward an upper part of said de-bubble area and therefore said bubbles in said electroplating solution are gathered and guided through said air hole to an outside of said electroplating bath main body.

A wafer electroplating apparatus, comprising:

• an electroplating bath main body, comprising:
• an electroplating bath disposed in an upper part of said electroplating bath main body in which a wafer holder and an anode net-plate are placed;
• an inlet device below said electroplating bath;
• a first de-bubble tank disposed in a lower part of said electroplating bath main body and connected to said inlet device;
• an air hole disposed on an upper surface of said first de-bubble tank and extending to an outer surface of said electroplating bath main body;
• and
• a baffle below said inlet device for an electroplating solution being prevented from entering said inlet device directly but passing along sides of said baffle instead, and therefore being buffered before entering said inlet device;
• and
• a fixing device comprising a second de-bubble tank and an outer shell, wherein when said electroplating bath main body is combined with said fixing device, said baffle is separated from an inner surface of said second de-bubble tank by a predetermined distance, and said outer shell is coupled to an inner surface of said first de-bubble tank, and said second de-bubble tank couples with said first de-bubble tank to form a de-bubble area for guiding said electroplating solution flow toward an upper part of said de-bubble area and therefore said bubbles in said electroplating solution are gathered and guided through said air hole to an outside of said electroplating bath main body.