Shield unit for TiN sputtering apparatus, method of coating the same, and sputtering method
AssigneeDongbuAnam Semiconductor Inc.
InventorKyo-Jun Ahn
Life of this patent
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Abstract
The present invention relates to a shield unit for a titanium nitride (TiN) sputtering apparatus that can reduce or prevent generation of unwanted particles. An exemplary shield unit for the sputtering apparatus according to an embodiment of the present invention includes an upper shield having a titanium (Ti) coating on an upper portion thereof and (optionally) an aluminum (Al) coating on a lower portion thereof, and a lower shield having a titanium (Ti) on at least part of a sidewall thereof and (optionally) an aluminum (Al) on a bottom surface thereof.
Claims19
A shield unit for protecting an interior part of a chamber in a sputtering apparatus, the shield unit comprising:
- an upper shield having a titanium (Ti) coating on an upper portion thereof;
- and
- a lower shield having a titanium (Ti) coating on at least part of a sidewall thereof.
A method of coating a shield unit for a sputtering apparatus, the shield unit comprising an upper shield and a lower shield, the method comprising:
- coating an upper portion of the upper shield with titanium;
- and
- coating at least part of an interior sidewall of the lower shield with titanium.
A method for sputtering titanium nitride, comprising:
- placing a substrate in a sputtering apparatus having a shield unit therein, the shield unit comprising an upper shield and a lower shield, the upper shield having a titanium coating on an upper portion thereof, and the lower shield having a titanium coating on at least part of an interior sidewall thereof;
- and
- depositing the titanium nitride on the substrate in the sputtering apparatus.
Dependencies are inferred from the claim text.