Method of manufacturing alloy sputtering targets
OwnerGerald Feldewerth, John Barnak +1inventors
InventorsGerald Feldewerth, John Barnak, Michael Goldstein
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Abstract
The present invention relates to a composite sputtering target comprising a plurality of bonded metal pieces. The composite sputtering target further comprises a bonded region between the metal pieces. The bonded region may comprise an inter-metallic region upon bonding. The composite sputter target of the present invention may be used in conjunction with an apparatus for sputtering alloy films on substrates.
Claims20
A sputtering target comprising:
- a first metal piece and a second metal piece, wherein said
- first metal piece is bonded to said second metal piece.
A sputtering apparatus comprising:
- a vacuum chamber comprising:
- a magnet assembly above the substrate,
- a sputtering target under said magnet assembly, wherein said
- sputtering target is comprised of a bonded first metal piece and a second metal piece.
A method of forming a sputtering target comprising:
- forming a first metal piece and a second metal piece;
- bonding said first metal piece and said second metal piece;
- forming a bonded region between said first metal piece and said second metal piece.
The method of forming a sputtering target comprising:
- forming a first metal piece and a second metal piece;
- containing said first metal piece and said second metal piece in a metal container;
- placing said metal container containing said first metal piece and said second metal piece in an enclosure;
- heating said enclosure at a temperature less than the melting temperatures of said first metal piece and said second metal piece;
- pressurizing said enclosure to form a good contact between said first metal piece and said second metal piece;
- bonding said first metal piece and said second metal piece into a bond within said enclosure, wherein said bonding occurs by diffusion of said first metal piece into said second metal piece or diffusion of said second metal piece into said first metal piece;
- removing bonded said first metal piece and said second metal piece from enclosure and said container.
A method of sputtering comprising:
- inserting a sputtering target into a sputtering apparatus, wherein said
- sputtering target comprises a bonded first metal piece and a second metal piece;
- sputtering said sputtering target to form thin layers.
Dependencies are inferred from the claim text.