Component for impedance matching
AssigneeHewlett-Packard Development Company, L.P.
InventorsSachin Chheda, Kirk Yates, Nitin Bhagwath
Life of this patent
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Abstract
A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.
Claims24
A component for insertion into a hole in a multiple-layer substrate enabling impedance matching of the substrate, the component comprising:
- a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted;
- a dielectric layer laterally encasing the conductive ground core;
- and
- a signal conductor layer coupled lateral to the dielectric layer.
A substrate comprising:
- a plurality of substrate layers including signal track layers and isolation layers, the substrate layer plurality being penetrated by a hole at a location suitable for transferring a signal between at least two signal track layers;
- and
- a component for insertion into the hole enabling signal transfer between the at least two signal track layers, the component comprising:
- a conductive ground core arranged for insertion through multiple-layers of the substrate layer plurality;
- a dielectric layer laterally encasing the conductive ground core;
- and
- a signal conductor layer coupled lateral to the dielectric layer.
A method for connecting signal tracks in a substrate comprising:
- providing a substrate with a plurality of substrate layers including signal track layers and isolation layers;
- forming a hole in the substrate layer plurality at a location suitable for transferring a signal between at least two signal track layers;
- and
- inserting into the hole an impedance-controlled component comprising an internal conductive ground core, a dielectric layer encasing the conductive ground core, and a signal conductor layer overlying the dielectric layer.
A component for insertion into a hole in a multiple-layer substrate enabling impedance matching of the substrate, the component comprising:
- means for conductively coupling to a ground plane in an arrangement that extends through multiple-layers of the substrate when the component is inserted;
- dielectric means for isolating the ground plane conductive coupling means;
- and
- means for conducting signals coupled lateral to the dielectric isolating means.
Dependencies are inferred from the claim text.