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US 2006/0137903 A1Published application
Memory module circuit board layer routing
OwnerJohn Sprietsma, Michael Leddigeinventors
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Abstract
In some embodiments a memory module circuit board includes a first layer with a first surface adapted to couple a first plurality of memory devices to the circuit board, and a second layer with a first portion and a second portion, the first portion including a plurality of first signal paths coupled to the first plurality of memory devices and the second portion including a reference voltage plane. Other embodiments are described and claimed.
Claims42
A memory module circuit board comprising:
- a first layer with a first surface adapted to couple a first plurality of memory devices to the circuit board;
- a second layer with a first portion and a second portion, the first portion including a plurality of first signal paths coupled to the first plurality of memory devices and the second portion including a reference voltage plane.
A memory module comprising:
- a first plurality of memory devices;
- and
- a circuit board including:
- a first layer with a first surface, the first plurality of memory devices coupled to the first surface;
- a second layer with a first portion and a second portion, the first portion including a plurality of first signal paths coupled to the first plurality of memory devices and the second portion including a reference voltage plane.
2 more elements
A system comprising:
- a motherboard;
- and
- a memory module coupled to the motherboard, the memory module comprising:
- a first plurality of memory devices;
- and
- a circuit board including:
- a first layer with a first surface, the first plurality of memory devices coupled to the first surface;
- a second layer with a first portion and a second portion, the first portion including a plurality of first signal paths coupled to the first plurality of memory devices and the second portion including a reference voltage plane.
5 more elements
Dependencies are inferred from the claim text.