Semiconductor device and manufacturing method therefor
AssigneeFujitsu Limited
InventorsYoshihiro Kubota, Kazuto Tsuji, Sumikazu Hosoyamada
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that a bonding resin may be disposed in a gap portion which communicates with the cavity between the circuit substrate and the heat radiating member, and by means of a bonding force of the bonding resin, the heat radiating member is permanently fixed to the circuit substrate.
Claims10
A semiconductor device, comprising:
- a semiconductor element;
- a circuit substrate having a cavity at a center thereof;
- a heat radiating member having said semiconductor element bonded at a central portion thereof;
- and
- a sealing resin configured to seal said semiconductor element in said cavity, wherein:
- a bonding resin is disposed in a gap portion which communicates with said cavity between said circuit substrate and said heat radiating member, and by means of adhesive power of said bonding resin, said heat radiating member is permanently fixed to said circuit substrate.
A semiconductor device manufacturing method for manufacturing a semiconductor device comprising a semiconductor element, a circuit substrate having a cavity produced at a center thereof, a heat radiating member and a sealing resin sealing said semiconductor element, comprising:
- a temporary fixing step of temporarily fixing said heat radiating member to said circuit substrate in such a manner that a gap portion may be produced between said heat radiating member and said circuit substrate;
- an element mounting step of disposing said semiconductor element inside of said cavity produced in said circuit substrate to which said radiating member is temporary fixed;
- and
- a sealing resin inserting step of inserting said sealing resin in said gap portion and said cavity by a potting process, and thereby, sealing said semiconductor element and also permanently fixing said heat radiating member to said circuit substrate.
A semiconductor device manufacturing method for manufacturing a semiconductor device comprising a semiconductor element, a circuit substrate having a cavity produced at a center thereof, a heat radiating member and a sealing resin sealing said semiconductor element, comprising:
- a temporary fixing step of temporarily fixing said heat radiating member to a dummy substrate part provided in a periphery of said circuit substrate in such a manner that a gap portion may be produced between said heat radiating member and said circuit substrate;
- an element mounting step of disposing said semiconductor element inside of said cavity produced in said circuit substrate to which said radiating member is temporary fixed;
- a sealing resin inserting step of inserting said sealing resin in said gap portion and said cavity by a potting process, and thereby, sealing said semiconductor element and also permanently fixing said heat radiating member to said circuit substrate;
- and
- a removing step of removing said dummy substrate part.
Dependencies are inferred from the claim text.