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US 2006/0137862 A1Published application
Heat dissipating device with metal foam
AssigneeFoxconn Technology Co., Ltd.
InventorsChing-Bai Huang, Xi-Jian Zhu
Life of this patent
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Abstract
A heat dissipating device for removing heat from a heat-generating electronic component includes at least one heat transfer device and metal foams combined to the heat transfer device. The heat transfer device may be a heat pipe. The heat generated by the electronic component is transferred to the metal foams through the heat transfer device. The metal foams are used for dissipating the heat to atmosphere.
Claims20
A heat dissipating device comprising:
- a heat pipe;
- and
- metal foams combined to an outer surface of the heat pipe.
A method for removing heat from an electronic component comprising the steps of:
- providing a heat transfer device having an elongated body portion;
- combining porous metal foams to one end of the body portion;
- and
- applying the other end of the body portion to be thermally connected to the electronic component to transfer heat from the electronic component to the metal foams via the heat transfer device.
1 more element
A heat dissipation device comprising:
- a heat pipe having a first end portion for thermally connecting with a heat-generating component, and a second end portion distant from the first end portion;
- and
- a metal foam thermally connecting with the second end portion for dissipating heat transferred by the heat pipe from the first end portion to the second end portion to atmosphere.
Dependencies are inferred from the claim text.