Heat flux based microchannel heat exchanger architecture for two phase and single phase flows

A method comprising:

• providing a first fluid flow for cooling a first area of a heat exchanger subject to a first incident heat flux;
• and
• providing a second fluid flow for cooling a second area of a heat exchanger subject to a second incident heat flux;
• and
• hydraulically coupling the first fluid flow and the second fluid flow substantially in series.

A system comprising:

• a semiconductor package having an integrated circuit, a first area having a first heat flux, and a second area having a second heat flux;
• and
• a thermal management arrangement, thermally coupled to the semiconductor package, to facilitate the dissipation of heat from the semiconductor package comprising
• a first plurality of cooling channels thermally coupled to the first area;
• a second plurality of cooling channels thermally coupled to the second area;
• and
• the first plurality of cooling channels hydraulically coupled substantially in series to the second plurality of cooling channels;
• and
• a mass storage device coupled to the semiconductor package.

A heat exchanger comprising:

• a first plurality of cooling channels filled with coolant and hydraulically coupled substantially in parallel to provide a first cooling capacity corresponding to a first region of an integrated circuit having a first heat flux;
• a second plurality of cooling channels filled with coolant and hydraulically coupled substantially in parallel to provide a second cooling capacity corresponding to a second region of an integrated circuit having a second heat flux;
• and
• the first plurality of cooling channels hydraulically coupled substantially in series to the second plurality of cooling channels.