Cooling systems incorporating heat transfer meshes
AssigneeCH Capital, Inc. aka CH Capital, LLC
InventorJohn Popovich
Life of this patent
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Abstract
Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
Claims56
Apparatus for cooling of an electrical element package, comprising in combination
- a) structure including a hollow body, defining a cavity containing cooling fluid,
- b) the structure defining an opening or passage whereby direct contact of the cooling fluid with said package is established for heat transfer from the package to the fluid contained in the cavity,
- c) a mesh located to enhance said heat transfer,
- d) and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh.
An apparatus for cooling an integrated circuit having a package, said apparatus being attachable to the integrated circuit and having a hollow body, wherein a cavity formed by said hollow body contains fluid for cooling of the integrated circuit through an opening of the cavity, and at the surface making contact between the cooling apparatus and the integrated circuit, so that the fluid is in direct contact with the integrated circuit's package.
Dependencies are inferred from the claim text.