US 2006/0137828 A1 · Die pickup apparatus

Abstract

The object of the present invention is to make it possible to pick up dies securely using a die push-up member without damaging the dies. A die push-up member 22 used for die-peeling which pushes the dies upward is disposed inside the suction holding stage 10 further toward the die feeding direction side than the die push-up member 21 used for die-pickup so that this die push-up member 22 can be move upward and downward. With the die push-up member 22 lowered, the die end portion (with respect to the die feeding direction) of the die 1A that is picked up is moved to above the die push-up member 22. Then, the die push-up member 22 is raised so that the die end portion (with respect to the die feeding direction) of the die 1A is peeled from the wafer sheet 2. Then, when the die push-up member 22 remaining in a raised state, the die 1A is fed to the pickup center 5, and is picked up by the collet 4 and die push-up member 21.

Claims9

Dependent claims

A die pickup apparatus comprising:

a suction holding stage that suction-holds a wafer sheet on which dies are pasted,
a die push-up member used for die-pickup which is disposed in said suction holding stage and pushes up a die, and
a collet which suction-holds a die that is pushed up by the die push-up member used for die-pickup and which conveys said die;
wherein said die-pickup apparatus further comprises a die push-up member used for die-peeling, said die push-up member used for die-peeling being movable upward and downward and provided inside said suction holding stage so as to be on a die feeding side with respect to said die push-up member used for die-pickup;
and
wherein said die-pickup apparatus,
with said die push-up member used for die-peeling lowered, moves an end portion of a die which is to be picked up located on the die feeding direction side to above said die push-up member used for die-peeling,
raises said die push-up member used for die-peeling so that the end portion of the die located on the die feeding direction side is peeled from said wafer sheet,
subsequently feeds the die with said die push-up member used for die-peeling raised, so that the die is partially or entirely peeled, and
allows said collet to pick up the die.

7 more elements

Dependencies are inferred from the claim text.

Die pickup apparatus

Life of this patent

Die pickup apparatus

Life of this patent

Abstract

Claims9