Target of high-purity nickel or nickel alloy and its producing method
AssigneeNikko Materials Co., Ltd.
InventorsYasuhiro Yamakoshi, Hirohito Miyashita
Life of this patent
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Abstract
Provided is high purity nickel or nickel alloy target for Magnetron sputtering having superior sputtering film uniformity and in which the magnetic permeability of the target is 100 or more, and this high purity nickel or a nickel alloy target for magnetron sputtering capable of achieving a favorable film uniformity (evenness of film thickness) and superior plasma ignition (firing) even during the manufacturing process employing a 300 mm wafer. The present invention also provides the manufacturing method of such high purity nickel or nickel alloy target.
Claims10
1-2. (canceled)
A method of manufacturing a high purity nickel or nickel alloy target for magnetron sputtering having superior sputtering film uniformity and in which magnetic permeability of the target is 100 or more, comprising the steps of:
- hot forging a high purity nickel or nickel alloy having a purity of 4N5 (99.995 wt %), and
- after said hot forging step, cold rolling said high purity nickel or nickel alloy at a rolling rate of 30% or more, and further performing heat treatment thereto for recrystallization at a temperature of 300° C. or higher,
- wherein the cold rolling and heat treatment steps are repeated at least two or more times.
5-7. (canceled)
Dependencies are inferred from the claim text.