Photoelectric conversion device
AssigneeNippon Oil Co., Ltd.
InventorsKeisuke Nakayama, Yoshinori Nishikitani
Life of this patent
Estimating the term…
Abstract
The present invention provide an all solid-state photoelectric conversion device which comprises a semiconductor, an electrically conductive substrate arranged on one surface of the semiconductor and forming an ohmic junction therewith, an electrically conductive film arranged on the other surface and forming a Schottky junction with the semiconductor, and a sensitizing dye layer arranged on the electrically conductive film, the roughness factor of the surface of the semiconductor forming a Schottky junction being 5 or greater. The photoelectric conversion device has a large effective surface area and a high durability and can be manufactured at a low cost.
Claims8
A photoelectric conversion device which comprises a semiconductor, an electrically conductive substrate arranged on one surface of the semiconductor and forming an ohmic junction therewith, an electrically conductive film arranged on the other surface and forming a Schottky junction with the semiconductor, and a sensitizing dye layer arranged on the electrically conductive film, the roughness factor of the surface of the semiconductor forming a Schottky junction being 5 or greater.
A process of manufacturing a photoelectric conversion device which comprises steps of:
- forming on an electrically conductive substrate a semiconductor forming an ohmic junction with said substrate;
- increasing the roughness factor of the surface of said semiconductor forming a Schottky junction with an electrically conductive film to 5 or greater;
- forming an electrically conductive film by joining on said semiconductor surface whose roughness factor is increased to 5 or greater an electrically conductive material forming a Schottky junction with said semiconductor;
- and forming on said film a sensitizing dye layer.
A process of manufacturing a photoelectric conversion device which comprises steps of:
- increasing the roughness factor of one surface of a semiconductor to 5 or greater;
- forming on the other surface of said semiconductor an electrically conductive substrate forming an ohmic junction with said semiconductor;
- forming an electrically conductive film by joining on said semiconductor surface whose roughness factor is increased to 5 or greater an electrically conductive material forming a Schottky junction with said semiconductor;
- and forming on said film a sensitizing dye layer.
Dependencies are inferred from the claim text.