Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same
AssigneeIntel Corporation
InventorsMohammad Farahani, Gregory Chrysler, Kris Frutschy
Life of this patent
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Abstract
A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.
Claims30
A method of fabricating a microelectronic assembly including a built-in TEC and a microelectronic device coupled to the TEC, the method comprising:
- providing the microelectronic device;
- fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.
A microelectronic assembly comprising:
- a microelectronic device;
- and
- a TEC coupled to the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.
A system comprising:
- a microelectronic assembly including:
- a microelectronic device;
- and
- a TEC coupled to the microelectronic device such that there is no mounting material between the TEC and the microelectronic device;
- and
- a graphics processor coupled to the microelectronic assembly.
A microelectronic arrangement comprising:
- a microelectronic assembly including:
- a microelectronic device;
- and
- a TEC coupled to the microelectronic device such that there is no mounting material between the TEC and the microelectronic device;
- and
- an electrical circuit electrically connected to the TEC and including a power source adapted to supply current to the TEC.
Dependencies are inferred from the claim text.