Cooling device for mr apparatus
AssigneeKoninklijke Philips Electronics N.V.
InventorJohannes Overweg
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AssigneeKoninklijke Philips Electronics N.V.
InventorJohannes Overweg
Estimating the term…
The invention relates to a cooling method for cooling a superconducting coil assembly in a MR apparatus, wherein the superconducting coil assembly 10 is cooled using a cooling agent 41, 42 which is in thermal contact with the superconducting coil assembly in a cooling chamber 20, the cooling agent being cooled by a refrigerator 50. The method comprises the steps of transferring (S2) cooling agent from the cooling chamber to a cooling agent storage when a predetermined temperature is exceeded in at least a part of the cooling agent in the cooling chamber, and returning (S4) cooling agent from the cooling agent storage to the cooling chamber when the temperature of at least a part of the cooling agent in the cooling chamber is equal to or less than the predetermined temperature. The invention also relates to a cooling device for performing the cooling method and to an MR apparatus with such a cooling device.
A cooling device for cooling a superconducting coil assembly in an MR apparatus, comprising:
A cooling method for cooling a superconducting coil assembly in an MR apparatus, wherein the superconducting coil assembly is cooled using a cooling agent which is in thermal contact with the superconducting coil assembly in a cooling chamber, the cooling agent being cooled by a refrigerator, characterized in that the method comprises the steps of
Dependencies are inferred from the claim text.