Back to results
US 2006/0137181 A1Published application
Cooling apparatus having low profile extrusion and method of manufacture therefor
AssigneeThermoTek, Inc.
InventorsOverton Parish, Roger DeVilbiss
Life of this patent
Estimating the term…
Abstract
A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Claims8
A method of removing heat from at least one heat generating component, comprising the steps of:
- positioning an evaporator section of a low profile member adjacent a heat generating component;
- transferring heat from the heat generating component to a heat transfer fluid contained within said low profile member and located within said evaporator section of said low profile member;
- migrating said heated fluid to a condenser region of said low profile member;
- cooling said fluid within said condenser region;
- and
- returning said fluid to said evaporator section.
3 more elements
Dependencies are inferred from the claim text.