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US 2006/0136862 A1Published application
Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
AssigneeKabushiki Kaisha Toshiba
InventorsShigeki Nojima, Akira Hamaguchi
Life of this patent
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Abstract
A pattern data verification method includes preparing exposure data related to a circuit pattern to be formed on a substrate, calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the exposure data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, and determining whether the exposure data is acceptable or rejectable based on the film thickness of the resist film after being developed.
Claims20
A pattern data verification method comprising:
- preparing exposure data related to a circuit pattern to be formed on a substrate;
- calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the exposure data;
- calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern;
- and
- determining whether the exposure data is acceptable or rejectable based on the film thickness of the resist film after being developed.
2 more elements
A pattern data creation method comprising:
- preparing design data related to a circuit pattern to be formed on a substrate;
- applying proximity effect correction to the design data;
- verifying post proximity effect correction data obtained by applying the proximity effect correction to the design data, comprising calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the post proximity effect correction data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, and determining whether the post proximity effect correction data is acceptable or rejectable based on the film thickness of the resist film after being developed;
- saving the post proximity effect correction data in a case where the post proximity effect correction data is determined to be acceptable in the verifying the post proximity effect correction data;
- and
- correcting the design data related to the circuit pattern or applying the proximity effect correction to the design data by changing a parameter related to the proximity effect correction or saving the post proximity effect correction data determined to be rejectable in a case where the post proximity effect correction data is determined to be rejectable in the verifying the post proximity effect correction data.
3 more elements
A pattern data creation method comprising:
- preparing design data related to a circuit pattern to be formed on a substrate;
- and
- applying proximity effect correction to the design data, comprising calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate and, the exposure pattern corresponding to post proximity effect correction data obtained by applying the proximity effect correction to the design data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, determining whether the post proximity effect correction data is acceptable or rejectable based on the film thickness of the resist film after being developed, saving the post proximity effect correction data in a case where the post proximity effect correction data is determined to be acceptable, and applying the proximity effect correction to the design data by changing a parameter related to the proximity effect correction or saving the post proximity effect correction data determined to be rejectable in a case where the post proximity effect correction data is determined to be rejectable.
A computer program product configured to store program instructions for execution on a computer system enabling the computer system to perform:
- an instruction to prepare exposure data related to a circuit pattern to be formed on a substrate;
- an instruction to calculate a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the exposure data;
- an instruction to calculate a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern;
- an instruction to determine whether the exposure data is acceptable or rejectable based on the film thickness of the resist film after being developed;
- and
- an instruction to save a result of the instruction to determine whether the exposure data is acceptable or rejectable.
3 more elements
A computer program product configured to store program instructions for execution on a computer system enabling the computer system to perform:
- an instruction to prepare design data related to a circuit pattern to be formed on a substrate;
- an instruction to apply proximity effect correction to the design data;
- an instruction to verify post proximity effect correction data obtained by applying the proximity effect correction to the design data, comprising calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the post proximity effect correction data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, and determining whether the post proximity effect correction data is acceptable or rejectable based on the film thickness of the resist film after being developed;
- an instruction to save the post proximity effect correction data in a case where the post proximity effect correction data is determined to be acceptable in the verifying the post proximity effect correction data;
- and
- an instruction to correct the design data related to the circuit pattern or applying the proximity effect correction to the design data by changing a parameter related to the proximity effect correction or saving the post proximity effect correction data determined to be rejectable in a case where the post proximity effect correction data is determined to be rejectable in the verifying the post proximity effect correction data.
3 more elements
A computer program product configured to store program instructions for execution on a computer system enabling the computer system to perform:
- an instruction to prepare design data related to a circuit pattern to be formed on a substrate;
- and
- an instruction to apply proximity effect correction to the design data, comprising calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate and, the exposure pattern corresponding to post proximity effect correction data obtained by applying the proximity effect correction to the design data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, determining whether the post proximity effect correction data is acceptable or rejectable based on the film thickness of the resist film after being developed, saving the post proximity effect correction data in a case where the post proximity effect correction data is determined to be acceptable, and applying the proximity effect correction to the design data by changing a parameter related to the proximity effect correction or saving the post proximity effect correction data determined to be rejectable in a case where the post proximity effect correction data is determined to be rejectable.
Dependencies are inferred from the claim text.