Component mounting apparatus, service providing device and servicing method

A service receiving method for receiving mounting technique data including cream solder information or adhesive information necessary for mount production, by the use of a service receiver provided by a user side for mount production using a cream solder printer or an adhesive applicator, from a service provider provided at a supplier side or a serviceperson side of the cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or of the adhesive applicator for applying an adhesive for adhering components onto the board, via a communication system including the Internet, the method comprising:

• inputting, by the service receiver, to the service provider, mounting technique data having the results of fabrication of non-defective products, via the communication system;
• and
• deriving, by the service receiver, the mounting technique data from a mounting technique database provided in the service provider, the mounting technique database containing the input mounting technique data accumulated for each type of component, cream solder, adhesive, or circuit board.

A service providing method for providing a component library including component size necessary for mount production, from a service provider provided at a supplier side or a serviceperson side of a component mounting apparatus, the component mounting apparatus including a component supplier for supplying a component and component holder for holding the component from the component supplier and mounting the component onto a circuit board, or a component mounting line in which connection is made so as to include the component mounting apparatus, to a service receiver provided at a user side for mount production using the component mounting apparatus or the component mounting line via a communication system including the Internet, the method comprising:

• receiving and collecting, by the service provider, mounted component data having the results of fabrication of non-defective products input by the service receiver via the communication system;
• and
• accumulating, by the service provider, the input mounted component data for each type of component in a mounted component database, from which the component library is derived by the service receiver.

A service providing device provided at a supplier side or a serviceperson side of a component mounting apparatus, the component mounting apparatus comprising a component supplier for supplying a component and component holder for holding the component from the component supplier and mounting the component onto a circuit board, or a component mounting line in which connection is made so as to include the component mounting apparatus, the service providing device configured for providing a component library, including component size necessary for mount production, to a service receiver provided at a user side for mount production using the component mounting apparatus or the component mounting line via a communication system including the Internet, the service providing device comprising:

• a mounted component database including mounted component data having the results of fabrication of non-defective products input by the service receiver via the communication system, the input mounted component data being accumulated for each type of component;
• and
• a controller configured for deriving the component library from the mounted component database in response to a request from the service receiver.

A service providing method for providing mounting technique data including cream solder information or adhesive information necessary for mount production, from a service provider provided at a supplier side or a serviceperson side of a cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or an adhesive applicator for applying an adhesive for adhering components onto the circuit board, to a service receiver provided at a user side for mount production using the cream solder printer or the adhesive applicator, via a communication system including the Internet, the method comprising:

• receiving and collecting, by the service provider, mounting technique data having the results of fabrication of non-defective products input by the service receiver via the communication system;
• and
• accumulating, by the service provider, the input mounting technique data for each type of component, cream solder, adhesive, or circuit board in a mounting technique database, from which the mounting technique data is derived by the service receiver.

A service providing device provided at a supplier side or a serviceperson side of a cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or an adhesive applicator for applying an adhesive for adhering components onto the board, the service providing device configured for providing mounting technique data including cream solder information or adhesive information necessary for mount production to a service receiver provided at a user side for mount production using the cream solder printer or the adhesive applicator via a communication system including the Internet, the device comprising:

• a mounting technique database including mounting technique data having the results of fabrication of non-defective products input by the service retriever via the communication system, the input mounting technique data being accumulated for each type of component, cream solder, adhesive, or circuit board;
• and
• a controller configured for deriving the mounting technique data from the mounting technique database in response to a request from the service receiver.