Epoxy resin compositions, methods of preparing and articles made therefrom
AssigneeResolution Performance Products LLC
InventorC. Shirrell
Life of this patent
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Abstract
A phenolic novolac cured epoxy resin system, preferably utilized in electrical laminating applications, producing resins with a favorable balance of properties including relatively low Dk values with comparable Tg and time to delaminate values. The phenolic novolac curing agent is substituted with alkyl or aryl groups, which may be the same or different. The alkyl group is preferably a C2-C20 group, more preferably a C4-C9 group, and most preferably a butyl or octyl group. The aryl group is preferably a phenyl group. The curing agents of the invention and may be used separately, in combination with each other, or in combination with other curing agents.
Claims21
An epoxy resin composition comprising an epoxy resin component, an optional solvent component, and a curing agent comprising at least one substituted novolac represented by the formula:
- wherein each Ar represents an aryl or cyclo-alkyl group containing x number of carbon atoms, OH represents a hydroxyl group bonded to each Ar group, each R1 represents substituent group(s) bonded to each Ar group and each R1 is an alkyl group or aryl group containing 2 to 20 carbon atoms, each R2 represents a group connecting adjacent Ar groups, n is a number between 2 and 20, x is an integer from 4 to 8, y is an integer from 1 to x-2, and z is an integer from 1 to x-3;
- and
- wherein a cured varnish comprising the epoxy resin composition has a dielectric constant (Dk), as determined in accordance with ASTM D150 at 1 MHz, of less than 3.5.
Dependencies are inferred from the claim text.