Curable encapsulant composition, device including same, and associated method

An electronic device, comprising:

• a composition encapsulating a circuit or die, the composition comprising:
• a mixture of a functionalized polymer and a reactive monomer composition,
• wherein the reactive monomer composition comprises a reactive monomer that is both a room temperature solid and present in the reactive monomer composition an amount in a range of greater than about 20 weight percent based on the total weight of reactive monomer composition, and
• the mixture is solid or tack-free, or both solid and tack-free at about room temperature.

A method of making an encapsulant, comprising:

• mixing a functionalized polymer with a reactive monomer composition, and the reactive monomer composition comprises at least one reactive monomer component that both is a low temperature solid and is present in the reactive monomer composition in an amount in a range of greater than about 20 weight percent based on the total weight of reactive monomer composition;
• heating to a temperature sufficient to soften or liquefy the mixture of the functionalized polymer and the reactive monomer composition;
• and
• cooling the softened or liquid mixture to form an encapsulant composition that is solid or tack-free, or both solid and tack-free at about room temperature.