Tack free compositions useful for electronic encapsulation
OwnerMichael Vallance, John Campbell +5inventors
InventorsMichael Vallance, John Campbell, Kenneth Zarnoch, Prameela Susarla, Bryan Duffey, Gary Yeager, Michael O'Brien
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Abstract
A tack-free composition comprising a functionalized polymer having a having a glass transition temperature greater than about 24° C., a reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., a reinforcing filler, and an initiator (curing agent) is provided. The tack-free composition is useful as a molding composition for encapsulation of electronic devices and electronic device components.
Claims21
A composition comprising:
- (a) at least one functionalized polymer having a glass transition temperature greater than about 24° C.;
- (b) at least one reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C.;
- (c) at least one reinforcing filler;
- and
- (d) at least one initiator;
- said composition being tack-free at room temperature.
A cured composition comprising structural units derived from:
- (a) at least one functionalized polymer having a glass transition temperature greater than about 24° C.;
- (b) at least one reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C.;
- (c) at least one reinforcing filler;
- and
- (d) at least one initiator;
- said composition being tack-free at room temperature prior to being cured.
A composition comprising:
- (a) at least one functionalized polyarylene ether having a glass transition temperature greater than about 24° C., said polyarylene ether comprising methacryloyl groups;
- (b) at least one reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., said reactive monomer comprises at least one moiety selected from the group consisting of alkeneyl groups, allyl groups, vinyl groups, acrylate groups, methacrylate groups, vinyl ether groups, vinyl ketone groups, epoxide groups, and glycidyl ether groups;
- (c) at least one reinforcing filler;
- and
- (d) at least one free radical initiator;
- said composition being tack-free at room temperature.
An electronic circuit comprising at least one active or passive component, said electronic circuit being encapsulated by a composition comprising structural units derived from:
- (a) at least one functionalized polymer having a glass transition temperature greater than about 24° C.;
- (b) at least one reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C.;
- (c) at least one reinforcing filler;
- and
- (d) at least one initiator;
- said composition being tack-free at room temperature.
Dependencies are inferred from the claim text.